自营库存
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259 条记录
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描述：1.00mm Pitch Pico-Clasp Wire-to-Board Header, Surface Mount, Dual Row, Vertical, 0.10µm Gold Plated, with Inner Positive Lock, with Pick-and-Place Tape, 20 Circuits
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含增值税
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描述：2.54mm Pitch C-Grid Header, Dual Row, Low Profile, Right Angle, Shrouded, 12 Circuits, 0.38µm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
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描述：2.00mm Milli-Grid Header, Vertical, Through Hole, Shrouded, 6 Circuits, 0.38µm Gold (Au) Plating, without Center Polarization Slot, with Locking Window, without PCB Locator, Tube
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含增值税
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描述：2.54mm SL Header, Single Row, Vertical, 3.05mm Pocket, Shrouded, 4 Circuits, 0.38µm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
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含增值税
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描述：Mini-Fit BMI Header Compliant Pin Interface, Dual Row, Vertical, 24 Circuits, 0.76µm Gold (Au) Selective Contact Plating, Tin (Sn) Press-fit Tail Plating
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含增值税
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描述：2.54mm Header, Surface Mount, Breakaway, Vertical, 6 Circuits, 0.38µm Gold (Au) Plating, Tape on Reel Packaging, with Cap, Lead-Free
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含增值税
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描述：3.0mm Right-Angle Header, Single Row, 10 Circuits, with Snap-in Plastic Peg PCB Lock, Gold, Glow-Wire Capable, Black
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含增值税
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描述：2.00mm Pitch Milli-Grid Header, Vertical, Through Hole, Shrouded, 8 Circuits, 0.38µm Gold (Au) Plating, with Center Polarization Slot, without Locking Window, without PCB Locator, Tube
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含增值税
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描述：3.0mm Right-Angle Header, Dual Row, 20 Circuits, with Snap-in Plastic Peg PCB Lock, Gold, Glow-Wire Capable, Black
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含增值税
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描述：3.0mm Vertical Header, 3.00mm Pitch, Dual Row, 8 Circuits, with Solder Tab, Gold, Glow-Wire Capable, Black
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含增值税
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描述：间距2.5mm 行距3.3mm 20P(2*10) Y键 黑色 垂直式 镀金0.38μm 推荐选用：1-1827875-0（X键 需整套更换）
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